Invention Grant
- Patent Title: Electronic device with heat dissipation apparatus
- Patent Title (中): 带散热装置的电子设备
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Application No.: US13554150Application Date: 2012-07-20
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Publication No.: US08830681B2Publication Date: 2014-09-09
- Inventor: Lei Liu
- Applicant: Lei Liu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201210202725 20120619
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F9/00
Abstract:
A heat dissipation apparatus for an electronic component installed in an enclosure of an electronic device includes a bracket and a heat sink. The bracket includes a supporting plate, an elastic positioning plate extending slantingly up from a side of the supporting plate away from the electronic component, and an installation plate extending from the positioning plate to be attached to the enclosure. The heat sink is fixed to the supporting plate to abut against the electronic component.
Public/Granted literature
- US20130335922A1 ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS Public/Granted day:2013-12-19
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