Invention Grant
US08830672B2 Computer system cooling using an externally-applied fluid conduit
有权
使用外部施加的流体导管进行计算机系统冷却
- Patent Title: Computer system cooling using an externally-applied fluid conduit
- Patent Title (中): 使用外部施加的流体导管进行计算机系统冷却
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Application No.: US13560617Application Date: 2012-07-27
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Publication No.: US08830672B2Publication Date: 2014-09-09
- Inventor: Shareef F. Alshinnawi , Gary D. Cudak , Christopher J. Hardee , Randall C. Humes , Adam Roberts , Edward S. Suffern , J. Mark Weber
- Applicant: Shareef F. Alshinnawi , Gary D. Cudak , Christopher J. Hardee , Randall C. Humes , Adam Roberts , Edward S. Suffern , J. Mark Weber
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Katherine S. Brown; Jeffrey L. Streets
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.
Public/Granted literature
- US20140029193A1 COMPUTER SYSTEM COOLING USING AN EXTERNALLY-APPLIED FLUID CONDUIT Public/Granted day:2014-01-30
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