Invention Grant
- Patent Title: Haptic feedback device
- Patent Title (中): 触觉反馈装置
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Application No.: US13668962Application Date: 2012-11-05
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Publication No.: US08830042B2Publication Date: 2014-09-09
- Inventor: Jae Kyung Kim , Dong Sun Park , Dae Woong Yun , Yeon Ho Son
- Applicant: Samsung Electro-Mechanics Co., Ltd
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: Staas & Halsey LLP
- Priority: KR10-2011-0142688 20111226
- Main IPC: H04B3/36
- IPC: H04B3/36
Abstract:
There is provided a haptic feedback device. The haptic feedback device includes a vibration member; a vibration element formed on the vibration member to vibrate the vibration member; and a mass member formed on the vibration member to adjust a oscillation frequency of the vibration member, wherein one surface of the mass member facing the vibration member is formed to have a curved shape.
Public/Granted literature
- US20130162415A1 HAPTIC FEEDBACK DEVICE Public/Granted day:2013-06-27
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