Invention Grant
US08829939B2 Shuttle plate having pockets for accomodating multiple semiconductor package sizes
有权
穿孔板具有用于容纳多种半导体封装尺寸的口袋
- Patent Title: Shuttle plate having pockets for accomodating multiple semiconductor package sizes
- Patent Title (中): 穿孔板具有用于容纳多种半导体封装尺寸的口袋
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Application No.: US13153005Application Date: 2011-06-03
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Publication No.: US08829939B2Publication Date: 2014-09-09
- Inventor: Mhark Lester Lauron Ponghon , Jose Karlo Garzon Tafalla , Rossbert Galvez Arguelles , Archie Gil Flores Quevedo , Christian Malunes Quidato , Allen Harvey Salazar Bata-Anon
- Applicant: Mhark Lester Lauron Ponghon , Jose Karlo Garzon Tafalla , Rossbert Galvez Arguelles , Archie Gil Flores Quevedo , Christian Malunes Quidato , Allen Harvey Salazar Bata-Anon
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frederick J. Telecky, Jr.
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/673 ; G01R31/28 ; G01R1/04
Abstract:
An input/output shuttle plate includes a metal plate having a plurality of pockets. The plurality of pockets have a bottom, a sidewall portion and a pocket depth. A first seating surface at a first pocket depth (d3) is for supporting a first packaged semiconductor device having a first package size, and at least a second seating surface at a second pocket depth (d4) is for supporting a second packaged semiconductor device having a second package size. The first pocket depth is less than the second pocket depth (d3
Public/Granted literature
- US20120306526A1 SHUTTLE PLATE HAVING POCKETS FOR ACCOMODATING MULTIPLE SEMICONDUCTOR PACKAGE SIZES Public/Granted day:2012-12-06
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