Invention Grant
- Patent Title: Bonded structures for package and substrate
- Patent Title (中): 包装和基材的结合结构
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Application No.: US13667306Application Date: 2012-11-02
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Publication No.: US08829673B2Publication Date: 2014-09-09
- Inventor: Ming-Hong Cha , Chita Chuang , Yao-Chun Chuang , Hao-Juin Liu , Tsung-Hsien Chiang , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.
Public/Granted literature
- US20140048929A1 Bonded Structures for Package and Substrate Public/Granted day:2014-02-20
Information query
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