Invention Grant
- Patent Title: Three dimensional integrated circuits
- Patent Title (中): 三维集成电路
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Application No.: US12834077Application Date: 2010-07-12
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Publication No.: US08829664B2Publication Date: 2014-09-09
- Inventor: Raminda Udaya Madurawe
- Applicant: Raminda Udaya Madurawe
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H03K19/173 ; H03K19/177

Abstract:
A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.
Public/Granted literature
- US20110102014A1 THREE DIMENSIONAL INTEGRATED CIRCUITS Public/Granted day:2011-05-05
Information query
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