Invention Grant
US08829645B2 Structure and method to form e-fuse with enhanced current crowding
有权
具有增强电流拥挤的电子熔丝的结构和方法
- Patent Title: Structure and method to form e-fuse with enhanced current crowding
- Patent Title (中): 具有增强电流拥挤的电子熔丝的结构和方法
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Application No.: US12137640Application Date: 2008-06-12
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Publication No.: US08829645B2Publication Date: 2014-09-09
- Inventor: Deok-Kee Kim , Ahmet S Ozcan , Haining S Yang
- Applicant: Deok-Kee Kim , Ahmet S Ozcan , Haining S Yang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An e-fuse structure and method has an anode; a fuse link (a first end of the fuse link is connected to the anode); a cathode (a second end of the fuse link opposite the first end is connected to the cathode); and a silicide layer on the fuse link. The silicide layer has a first silicide region adjacent the anode and a second silicide region adjacent the cathode. The second silicide region comprises an impurity not contained within the first silicide region. Further, the first silicide region is thinner than the second silicide region.
Public/Granted literature
- US20090309184A1 STRUCTURE AND METHOD TO FORM E-FUSE WITH ENHANCED CURRENT CROWDING Public/Granted day:2009-12-17
Information query
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