Invention Grant
US08829612B2 Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacers
有权
形成不对称间隔物的方法和使用不对称间隔物制造半导体器件的方法
- Patent Title: Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacers
- Patent Title (中): 形成不对称间隔物的方法和使用不对称间隔物制造半导体器件的方法
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Application No.: US12983477Application Date: 2011-01-03
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Publication No.: US08829612B2Publication Date: 2014-09-09
- Inventor: Kangguo Cheng , Xi Li , Richard Stephen Wise
- Applicant: Kangguo Cheng , Xi Li , Richard Stephen Wise
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Matthew Zehrer
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A method of fabricating asymmetrical spacers, structures fabricated using asymmetrical spacers and an apparatus for fabricating asymmetrical spacers. The method includes: forming on a substrate, a structure having a top surface and opposite first and second sidewalls and having a longitudinal axis parallel to the sidewalls; forming a conformal layer on the top surface of the substrate, the top surface of the structure and the sidewalls of the structure; tilting the substrate about a longitudinal axis relative to a flux of reactive ions, the flux of reactive ions striking the conformal layer at acute angle; and exposing the conformal layer to the flux of reactive ions until the conformal layer is removed from the top surface of the structure and the top surface of the substrate leaving a first spacer on the first sidewall and a second spacer on the second sidewall, the first spacer thinner than the second spacer.
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