Invention Grant
- Patent Title: Semiconductor light emission element
- Patent Title (中): 半导体发光元件
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Application No.: US13139642Application Date: 2009-12-14
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Publication No.: US08829555B2Publication Date: 2014-09-09
- Inventor: Koji Kamei , Remi Ohba , Takashi Hodota
- Applicant: Koji Kamei , Remi Ohba , Takashi Hodota
- Applicant Address: JP Aichi
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-318700 20081215; JP2008-320027 20081216; JP2009-083126 20090330
- International Application: PCT/JP2009/070841 WO 20091214
- International Announcement: WO2010/071113 WO 20100624
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/42 ; H01L33/32 ; H01L33/40

Abstract:
A semiconductor light emission element (1) includes: a substrate (110); multi-layered semiconductor layers (100) including a light emission layer (150) and layered on the substrate (110); a transparent electrode (170) including an indium oxide and layered on the multi-layered semiconductor layers (100); a first junction layer (190) including tantalum as a valve action metal and layered on the transparent electrode (170) in such a manner that a side of the first junction layer (190) being in contact with the transparent electrode (170) is a tantalum nitride layer or a tantalum oxide layer; and a first bonding pad electrode (200) layered on the first junction layer (190) and used for electrical connection with outside. This improves a bonding property of the transparent electrode or the semiconductor layer with the connection electrode and reliability of the electrodes.
Public/Granted literature
- US20110316037A1 SEMICONDUCTOR LIGHT EMISSION ELEMENT Public/Granted day:2011-12-29
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