Invention Grant
- Patent Title: Replacement channels
- Patent Title (中): 替换渠道
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Application No.: US13446375Application Date: 2012-04-13
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Publication No.: US08828813B2Publication Date: 2014-09-09
- Inventor: Yu-Lien Huang , Meng-Chun Chang
- Applicant: Yu-Lien Huang , Meng-Chun Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/338
- IPC: H01L21/338

Abstract:
The present disclosure relates to a device and method for strain inducing or high mobility channel replacement in a semiconductor device. The semiconductor device is configured to control current from a source to a drain through a channel region by use of a gate. A strain inducing or high mobility layer produced in the channel region between the source and drain can result in better device performance compared to Si, faster devices, faster data transmission, and is fully compatible with the current semiconductor manufacturing infrastructure.
Public/Granted literature
- US20130270628A1 Replacement Channels Public/Granted day:2013-10-17
Information query
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