Invention Grant
US08828801B2 Leadless array plastic package with various IC packaging configurations
有权
无铅阵列塑料封装，具有各种IC封装配置
- Patent Title: Leadless array plastic package with various IC packaging configurations
- Patent Title (中): 无铅阵列塑料封装，具有各种IC封装配置
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Application No.: US13916391Application Date: 2013-06-12
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Publication No.: US08828801B2Publication Date: 2014-09-09
- Inventor: John McMillan , Serafin P. Pedron, Jr. , Kirk Powell , Adonis Fung
- Applicant: UTAC Hong Kong Limited
- Applicant Address: HK Tsuen Wan
- Assignee: UTAC Hong Kong Limited
- Current Assignee: UTAC Hong Kong Limited
- Current Assignee Address: HK Tsuen Wan
- Agency: Winstead PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/495 ; H01L23/31 ; H01L21/48 ; H01L21/56
Abstract:
A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.
Public/Granted literature
- US20130273692A1 LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURATIONS Public/Granted day:2013-10-17
Information query
IPC分类:
