Invention Grant
- Patent Title: Cover tape
- Patent Title (中): 封面胶带
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Application No.: US13124009Application Date: 2009-11-05
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Publication No.: US08828535B2Publication Date: 2014-09-09
- Inventor: Hisatsugu Tokunaga , Yusuke Tanazawa
- Applicant: Hisatsugu Tokunaga , Yusuke Tanazawa
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-289453 20081112; JP2009-066060 20090318
- International Application: PCT/JP2009/068900 WO 20091105
- International Announcement: WO2010/055804 WO 20100520
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B32B27/32 ; B32B7/12 ; B32B27/08 ; B32B27/30

Abstract:
Provided is a cover tape that has a small range of stripping strength and generates little static electricity when stripped at a high speed. The cover tape according to the present invention comprises at least a substrate layer, an intermediate layer, a charge transfer layer, and a heat seal layer, characterized in that (A) the charge transfer layer containing an acid-modified polyolefin resin and a conductive agent, and (B) the heat seal layer containing (a) a thermoplastic resin component composed of an acrylic resin, and (b) a styrene-conjugated diene copolymer or a hydrogenated resin thereof, the mass ratio of the two components ((a)/(b)) being 20/80 to 80/20.
Public/Granted literature
- US20110212324A1 COVER TAPE Public/Granted day:2011-09-01
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