Invention Grant
- Patent Title: Photocurable resin composition for sealing organic EL device
- Patent Title (中): 用于密封有机EL器件的光固化树脂组合物
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Application No.: US12614187Application Date: 2009-11-06
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Publication No.: US08828500B2Publication Date: 2014-09-09
- Inventor: Yoshihide Arai , Hiromasa Kitazawa , Kenichi Horie
- Applicant: Yoshihide Arai , Hiromasa Kitazawa , Kenichi Horie
- Applicant Address: JP Tokyo
- Assignee: Three Bond Co., Ltd.
- Current Assignee: Three Bond Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2008-305666 20081128
- Main IPC: C08L63/00
- IPC: C08L63/00 ; G03F7/075 ; G03F7/038 ; C08G59/22 ; C08G59/68 ; C09J163/00 ; H01L51/52

Abstract:
A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.
Public/Granted literature
- US20100137530A1 PHOTOCURABLE RESIN COMPOSITION FOR SEALING ORGANIC EL DEVICE Public/Granted day:2010-06-03
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