Invention Grant
- Patent Title: Process for cleaning wafers
- Patent Title (中): 清洗晶圆的工艺
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Application No.: US13350007Application Date: 2012-01-13
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Publication No.: US08828144B2Publication Date: 2014-09-09
- Inventor: Soichi Kumon , Takashi Saio , Shinobu Arata , Masanori Saito , Hidehisa Nanai , Yoshinori Akamatsu
- Applicant: Soichi Kumon , Takashi Saio , Shinobu Arata , Masanori Saito , Hidehisa Nanai , Yoshinori Akamatsu
- Applicant Address: JP Ube-shi
- Assignee: Central Grass Company, Limited
- Current Assignee: Central Grass Company, Limited
- Current Assignee Address: JP Ube-shi
- Agency: Crowell & Moring LLP
- Priority: JP2010-293853 20101228; JP2011-238623 20111031; JP2011-274084 20111215
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02
Abstract:
A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.
Public/Granted literature
- US20120211025A1 PROCESS FOR CLEANING WAFERS Public/Granted day:2012-08-23
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