Systems, methods, and other embodiments associated with analyzing interconnects for global wires of a circuit are described. In one embodiment, for a target wire in a circuit design, a method includes determining an inductance value and a capacitance value for parallel wires to the target wire. The method then calculates a second capacitance value for non-parallel wires to the target wire and calculates an estimated inductance value for the non-parallel wires based on the second capacitance value. A circuit model for the target wire may then be generated using the inductance and capacitance values.