Invention Grant
- Patent Title: Semiconductor device including plural chips stacked to each other
- Patent Title (中): 包括彼此堆叠的多个芯片的半导体装置
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Application No.: US14175839Application Date: 2014-02-07
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Publication No.: US08797822B2Publication Date: 2014-08-05
- Inventor: Homare Sato
- Applicant: Homare Sato
- Applicant Address: LU Luxembourg
- Assignee: PS4 Luxco S.A.R.L.
- Current Assignee: PS4 Luxco S.A.R.L.
- Current Assignee Address: LU Luxembourg
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-007204 20110117
- Main IPC: G11C8/00
- IPC: G11C8/00 ; G06F12/02 ; G06F12/08 ; G11C8/12 ; G11C5/02 ; G11C5/04

Abstract:
A method for accessing a plurality of DRAM devices each having a plurality of banks, includes determining an operating mode for the plurality of DRAM devices, providing a chip selection address and a bank address with an active command to activate a first bank in a first one of the plurality of DRAM devices and, while the first bank in the first one of the plurality of DRAM devices is activated, one or more first banks in remaining DRAM devices of the plurality of DRAM devices are: not activated if the operating mode is determined to be a logical rank address mode, and possibly activated if the operating mode is determined to be a physical rank address mode, and subsequently providing at least a bank address with a column command to access the first bank in the first one of the plurality of DRAM devices.
Public/Granted literature
- US20140153352A1 SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER Public/Granted day:2014-06-05
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