Invention Grant
- Patent Title: Vertical memory with body connection
- Patent Title (中): 垂直记忆与身体连接
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Application No.: US13561946Application Date: 2012-07-30
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Publication No.: US08797804B2Publication Date: 2014-08-05
- Inventor: Toru Tanzawa
- Applicant: Toru Tanzawa
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G11C16/06
- IPC: G11C16/06 ; G11C16/08
Abstract:
An embodiment of an apparatus includes a substrate, a body semiconductor, a vertical memory access line stack over the body semiconductor, and a body connection to the body semiconductor.
Public/Granted literature
- US20140029352A1 VERTICAL MEMORY WITH BODY CONNECTION Public/Granted day:2014-01-30
Information query
