Invention Grant
- Patent Title: Ultra-wideband assembly system and method
- Patent Title (中): 超宽带组装系统及方法
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Application No.: US13310621Application Date: 2011-12-02
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Publication No.: US08797761B2Publication Date: 2014-08-05
- Inventor: John Mruz
- Applicant: John Mruz
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.
Public/Granted literature
- US20120075820A1 Ultra-Wideband Assembly System and Method Public/Granted day:2012-03-29
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