Invention Grant
- Patent Title: Sliding module for electronic device
- Patent Title (中): 电子设备滑动模块
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Application No.: US13220186Application Date: 2011-08-29
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Publication No.: US08797730B2Publication Date: 2014-08-05
- Inventor: Chao Duan , Chia-Hua Chen
- Applicant: Chao Duan , Chia-Hua Chen
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110125274 20110516
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A sliding module includes a first section, a second section, a pivot plate, a hinge module and an assist lever. Two sides of the pivot plate are respectively rotatably connected to the first section and the hinge module. The hinge module is positioned on the second section. Two ends of the assist lever are respectively rotatably connected to the first section and the second section. The first section brings the pivot plate to rotate relative to the hinge module, and elevates the assist lever, the pivot plate and the assist lever bring the first section to move and rotate relative to the second section in a tilted orientation.
Public/Granted literature
- US20120293927A1 SLIDING MODULE FOR ELECTRONIC DEVICE Public/Granted day:2012-11-22
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