Invention Grant
- Patent Title: Deformation measuring apparatus and deformation measuring method
- Patent Title (中): 变形测量仪和变形测量方法
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Application No.: US13114238Application Date: 2011-05-24
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Publication No.: US08797515B2Publication Date: 2014-08-05
- Inventor: Takashi Sugimoto
- Applicant: Takashi Sugimoto
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. IP Division
- Priority: JP2010-129275 20100604
- Main IPC: G01L1/24
- IPC: G01L1/24 ; G01B11/24 ; G01B11/30 ; G01B11/02 ; G01B9/02 ; G01B11/16

Abstract:
An apparatus and a method capable of measuring large deformation with a high accuracy and dynamically, using speckle interference, utilizes an optical path where one laser beam out of two laser beams becomes non-collimated light and a plane parallel transparent plate, and can form carrier fringes. More specifically, the transparent plate is arranged on the optical path where the non-collimated light is formed, or is removed from the optical path, or a refractive index, or a thickness of the transparent plate arranged on the optical path, or a tilt angle relative to an optical axis is changed. The phase analysis can be performed from fringe images corresponding to the deformation, by performing repetitively the above-described processing and acquisition of the speckle interference pattern.
Public/Granted literature
- US20110299064A1 DEFORMATION MEASURING APPARATUS AND DEFORMATION MEASURING METHOD Public/Granted day:2011-12-08
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