Invention Grant
US08797508B2 Exposure apparatus, exposure method, and device manufacturing method 有权
曝光装置,曝光方法和装置制造方法

  • Patent Title: Exposure apparatus, exposure method, and device manufacturing method
  • Patent Title (中): 曝光装置,曝光方法和装置制造方法
  • Application No.: US12265831
    Application Date: 2008-11-06
  • Publication No.: US08797508B2
    Publication Date: 2014-08-05
  • Inventor: Yuichi Shibazaki
  • Applicant: Yuichi Shibazaki
  • Applicant Address: JP Tokyo
  • Assignee: Nikon Corporation
  • Current Assignee: Nikon Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff PLC
  • Priority: JP2007-289203 20071107
  • Main IPC: G03B27/58
  • IPC: G03B27/58 G03F7/20
Exposure apparatus, exposure method, and device manufacturing method
Abstract:
During the transition from a state where one of wafer stages is located in an area below a projection optical system where a liquid immersion area is formed to a state where the other of the wafer stages is located in the area, both the wafer stages are made to be in proximity or in contact in a Y-axis direction in a state of being shifted in an X-axis direction, by making an overhang section and a stepped section that are arranged respectively on the wafer stages be engaged, and both the wafer stages are simultaneously driven in the Y-axis direction while maintaining this state. Accordingly, the liquid immersion area is delivered between the two wafer stages via the overhang section and leakage of a liquid that forms the liquid immersion area is restrained.
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