A semiconductor device includes a substrate, a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a layer and another one of the ground lines extending from the one of the ground lines toward another direction in the layer, a first pad on the multi-layer wiring layer, and a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first pad and the second pad, and an insulation film covering the redistribution line.