Invention Grant
US08796842B2 Stacked semiconductor chip device with thermal management circuit board
有权
具有热管理电路板的堆叠半导体芯片器件
- Patent Title: Stacked semiconductor chip device with thermal management circuit board
- Patent Title (中): 具有热管理电路板的堆叠半导体芯片器件
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Application No.: US12860244Application Date: 2010-08-20
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Publication No.: US08796842B2Publication Date: 2014-08-05
- Inventor: Gamal Refai-Ahmed , Michael Z. Su , Bryan Black
- Applicant: Gamal Refai-Ahmed , Michael Z. Su , Bryan Black
- Applicant Address: CA Markham US CA Sunnyvale
- Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee Address: CA Markham US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.
Public/Granted literature
- US20120043669A1 STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT CIRCUIT BOARD Public/Granted day:2012-02-23
Information query
IPC分类:
