Invention Grant
- Patent Title: Perylene-imide semiconductor polymers
- Patent Title (中): 苝酰亚胺半导体聚合物
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Application No.: US12812531Application Date: 2009-02-05
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Publication No.: US08796672B2Publication Date: 2014-08-05
- Inventor: Antonio Facchetti , He Yan , Zhihua Chen , Marcel Kastler , Florian Doetz
- Applicant: Antonio Facchetti , He Yan , Zhihua Chen , Marcel Kastler , Florian Doetz
- Applicant Address: US IL Skokie DE Ludwigshafen
- Assignee: Polyera Corporation,BASF SE
- Current Assignee: Polyera Corporation,BASF SE
- Current Assignee Address: US IL Skokie DE Ludwigshafen
- Agent Karen K. Chan
- International Application: PCT/EP2009/051311 WO 20090205
- International Announcement: WO2009/098250 WO 20090813
- Main IPC: H01L51/30
- IPC: H01L51/30
Abstract:
Disclosed are new semiconductor materials prepared from perylene-imide copolymers. Such polymers can exhibit high n-type carrier mobility and/or good current modulation characteristics. In addition, the compounds of the present teachings can possess certain processing advantages such as solution-processability and/or good stability at ambient conditions.
Public/Granted literature
- US20100283047A1 PERYLENE-IMIDE SEMICONDUCTOR POLYMERS Public/Granted day:2010-11-11
Information query
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