Invention Grant
- Patent Title: Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
- Patent Title (中): 具有硅亚苯基和硅氧烷结构的聚合物，其制备方法，粘合剂组合物，粘合片，半导体器件用保护材料和半导体器件
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Application No.: US13469764Application Date: 2012-05-11
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Publication No.: US08796410B2Publication Date: 2014-08-05
- Inventor: Michihiro Sugo , Kazunori Kondo
- Applicant: Michihiro Sugo , Kazunori Kondo
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-115020 20110523; JP2011-115022 20110523
- Main IPC: C08G77/08
- IPC: C08G77/08
Abstract:
One aspect of the present invention provides a polymer having repeating units represented by the formulas (1-1), (1-2) and (1-3) and weight-average molecular weight of from 3,000 to 500,000, as determined by GPC using tetrahydrofuran as a solvent, reduced to polystyrene. Another aspect of the present invention provides an adhesive composition comprising (A) the polymer, (B) a thermosetting resin, and (C) a compound having flux activity. Further, the present invention provides an adhesive sheet having an adhesive layer made of the adhesive composition, a protective material for a semiconductor device, which has the adhesive layer, and a semiconductor device having a cured product obtained from the adhesive composition.
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