Invention Grant
- Patent Title: Pixel structure and fabricating method thereof
- Patent Title (中): 像素结构及其制造方法
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Application No.: US13682747Application Date: 2012-11-21
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Publication No.: US08796079B2Publication Date: 2014-08-05
- Inventor: Yih-Chyun Kao , Hao-Lin Chiu , Chun-Nan Lin
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW100143135A 20111124
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/12 ; H01L29/786

Abstract:
A fabrication method of a pixel structure and a pixel structure are provided. A first patterned metal layer including scan lines and a gate is formed on a substrate. A first insulation layer, a semiconductor layer, an etching stop pattern and a metal layer are formed sequentially on the first patterned metal layer. The metal layer and the semiconductor layer are patterned to form a second patterned metal layer and a patterned semiconductor layer. The second patterned metal layer includes data lines, a source and a drain. The patterned semiconductor layer includes a first semiconductor pattern completely overlapping the second patterned metal layer and a second semiconductor pattern without overlapping the second patterned metal layer, wherein the second semiconductor pattern includes a channel pattern and a marginal pattern. The channel pattern is between the source and the drain and the marginal pattern surrounds the first semiconductor pattern.
Public/Granted literature
- US20130134489A1 PIXEL STRUCTURE AND FABRICATING METHOD THEREOF Public/Granted day:2013-05-30
Information query
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