Invention Grant
- Patent Title: Positive resist composition and patterning process
- Patent Title (中): 正抗蚀剂组成和图案化工艺
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Application No.: US12000284Application Date: 2007-12-11
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Publication No.: US08795942B2Publication Date: 2014-08-05
- Inventor: Tomohiro Kobayashi , Youichi Ohsawa , Ryosuke Taniguchi
- Applicant: Tomohiro Kobayashi , Youichi Ohsawa , Ryosuke Taniguchi
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2006-348203 20061225
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/38

Abstract:
There is disclosed a resist composition that remarkably improves the resolution of photolithography using a high energy beam such as ArF excimer laser light as a light source, and exhibits excellent resistance to surface roughness and side lobe under use of a halftone phase shift mask; and a patterning process using the resist composition. The positive resist composition at least comprises (A) a resin component comprising a repeating unit represented by the following general formula (1); (B) a photoacid generator generating sulfonic acid represented by the following general formula (2) upon exposure to a high energy beam; and (C) an onium salt where a cation is sulfonium represented by the following general formula (3), or ammonium represented by the following general formula (4); and an anion is represented by any one of the following general formulae (5) to (7).
Public/Granted literature
- US20080153030A1 Positive resist composition and patterning process Public/Granted day:2008-06-26
Information query
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