Invention Grant
- Patent Title: Electrodeposition under illumination without electrical contacts
- Patent Title (中): 在没有电气接触的照明下电沉积
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Application No.: US12778689Application Date: 2010-05-12
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Publication No.: US08795502B2Publication Date: 2014-08-05
- Inventor: John M. Cotte , Harold J. Hovel , Devendra K. Sadana , Xiaoyan Shao , Steven Erik Steen
- Applicant: John M. Cotte , Harold J. Hovel , Devendra K. Sadana , Xiaoyan Shao , Steven Erik Steen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Agent Louis J. Percello, Esq.
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D5/02 ; C25D7/12 ; C25D17/00
Abstract:
A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.
Public/Granted literature
- US20110278172A1 ELECTRODEPOSITION UNDER ILLUMINATION WITHOUT ELECTRICAL CONTACTS Public/Granted day:2011-11-17
Information query
