Invention Grant
- Patent Title: Thermal sensing structure and insulating structure of thermal sensing circuit
- Patent Title (中): 热感应电路的热敏结构和绝缘结构
-
Application No.: US12654401Application Date: 2009-12-18
-
Publication No.: US08794827B2Publication Date: 2014-08-05
- Inventor: Satoshi Ishikawa , Susumu Yamamoto
- Applicant: Satoshi Ishikawa , Susumu Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2009-021120 20090202; JP2009-028412 20090210
- Main IPC: G01K5/00
- IPC: G01K5/00

Abstract:
Flexible circuits 2, 3 are formed on a flexible insulating sheet 1. A thermal sensor 4 is connected between the circuits 2, 3. The thermal sensor 4 and connecting parts 5 are integrally covered with an elastic insulating resin 6. While the insulating sheet 1 is bent together with the insulating resin 6, the thermal sensor 4 is pushed onto an object to be sensed 8 via the insulating sheet 1. A plurality of thermal sensors 4 are connected in series in a longitudinal direction of the insulating sheet 1. The insulating resin 6 covers the thermal sensors 4 and the connecting parts 5.
Public/Granted literature
- US20100195696A1 Thermal sensing structure and insulating structure of thermal sensing circuit Public/Granted day:2010-08-05
Information query