Invention Grant
- Patent Title: 2-Pass heat exchanger including thermal expansion joints
- Patent Title (中): 2通热交换器包括热膨胀节
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Application No.: US11711455Application Date: 2007-02-27
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Publication No.: US08794299B2Publication Date: 2014-08-05
- Inventor: Robert J. Barfknecht , Biao Yu , LeRoy Goines , Robert J. DeGroot , Peter C. Kottal , Steven P. Meshenky , Dan R. Raduenz
- Applicant: Robert J. Barfknecht , Biao Yu , LeRoy Goines , Robert J. DeGroot , Peter C. Kottal , Steven P. Meshenky , Dan R. Raduenz
- Applicant Address: US WI Racine
- Assignee: Modine Manufacturing Company
- Current Assignee: Modine Manufacturing Company
- Current Assignee Address: US WI Racine
- Agency: Michael Best & Friedrich LLP
- Main IPC: F28F27/02
- IPC: F28F27/02
Abstract:
A heat exchanger (10) is provided and in a highly preferred form is an EGR cooler (52) having first and second passes (56A,56B) that are connected to an inlet/outlet manifold (70) by a pair of corresponding thermal expansion joints (87,93) to allow differential thermal expansion between the various structural components of the heat exchanger (10).
Public/Granted literature
- US20080202739A1 2-Pass heat exchanger including internal bellows assemblies Public/Granted day:2008-08-28
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