Invention Grant
- Patent Title: Double-faced adhesive tape joining apparatus
- Patent Title (中): 双面胶带接合装置
-
Application No.: US13266537Application Date: 2010-04-20
-
Publication No.: US08794292B2Publication Date: 2014-08-05
- Inventor: Shinji Inokuchi , Kazuhiko Kinpara , Naoto Kato , Isao Hirose
- Applicant: Shinji Inokuchi , Kazuhiko Kinpara , Naoto Kato , Isao Hirose
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2009-111963 20090501
- International Application: PCT/JP2010/002844 WO 20100420
- International Announcement: WO2010/125766 WO 20101104
- Main IPC: B65H37/02
- IPC: B65H37/02 ; B65H37/04 ; B65H35/08

Abstract:
Provided is double-faced adhesive tape joining apparatus that allows accurate joining of a double-faced adhesive tape on a tape joining surface of a workpiece in a curved or bent shape with no damage on a surface of a separator joined to the double-faced adhesive tape and no floating of the separator. Specifically, a hand-operable base includes a tape guide for guiding the double-faced adhesive tape successively supplied, and a joining head for pressing against the joining surface of the workpiece the double-faced adhesive tape supplied to a front end of the base. The base and the joining head are configured as to rotate relatively about a support axis toward a longitudinal tape direction.
Public/Granted literature
- US20120055635A1 DOUBLE-FACED ADHESIVE TAPE JOINING APPARATUS Public/Granted day:2012-03-08
Information query