Invention Grant
US08794071B2 Ultrasonic wave sensor and method for attaching ultrasonic wave sensor
有权
超声波传感器及附着超声波传感器的方法
- Patent Title: Ultrasonic wave sensor and method for attaching ultrasonic wave sensor
- Patent Title (中): 超声波传感器及附着超声波传感器的方法
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Application No.: US13395903Application Date: 2010-01-21
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Publication No.: US08794071B2Publication Date: 2014-08-05
- Inventor: Satoru Inoue , Tomonori Kimura , Kouji Ibata , Yukio Nishimoto
- Applicant: Satoru Inoue , Tomonori Kimura , Kouji Ibata , Yukio Nishimoto
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/JP2010/000319 WO 20100121
- International Announcement: WO2011/089644 WO 20110728
- Main IPC: G01N29/09
- IPC: G01N29/09 ; B60R19/48
Abstract:
An ultrasonic sensor of the present invention is attached to the back face of a bumper 4, and provided with a matching member 3 that is in intimate contact with the ultrasonic wave transmitting surface of the ultrasonic sensor and the opposing face of the bumper 4 and that has an acoustic impedance smaller than each of the impedances of the sensor and the bumper.
Public/Granted literature
- US20120180569A1 ULTRASONIC WAVE SENSOR AND METHOD FOR ATTACHING ULTRASONIC WAVE SENSOR Public/Granted day:2012-07-19
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