Invention Grant
- Patent Title: Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (TECs)
- Patent Title (中): 利用原位测量技术结合热电芯片(TEC)的方法和装置
-
Application No.: US13270522Application Date: 2011-10-11
-
Publication No.: US08794011B2Publication Date: 2014-08-05
- Inventor: Alton H. Phillips , Akio Ohta , Douglas C. Watson
- Applicant: Alton H. Phillips , Akio Ohta , Douglas C. Watson
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: F25B21/02
- IPC: F25B21/02

Abstract:
According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.
Public/Granted literature
Information query