Invention Grant
- Patent Title: Laser cooling of modified SOI wafer
- Patent Title (中): 改性SOI晶片的激光冷却
-
Application No.: US12966394Application Date: 2010-12-13
-
Publication No.: US08794010B2Publication Date: 2014-08-05
- Inventor: David L. Williams , Andrew Clark , Michael Lebby
- Applicant: David L. Williams , Andrew Clark , Michael Lebby
- Applicant Address: US CA Palo Alto
- Assignee: Translucent, Inc.
- Current Assignee: Translucent, Inc.
- Current Assignee Address: US CA Palo Alto
- Main IPC: H01S3/30
- IPC: H01S3/30 ; H01S3/034 ; F25B23/00 ; F25B21/00

Abstract:
A laser cooling system includes a substrate, an REO layer of single crystal rare earth oxide including at least one rare earth element positioned on the surface of the substrate, and an active layer of single crystal semiconductor material positioned on the REO layer to form a semiconductor-on-insulator (SOI) device. Light guiding structure is at least partially formed by the REO layer so as to introduce energy elements into the REO layer and produce cooling by anti-Stokes fluorescence. The active layer of single crystal semiconductor material is positioned on the REO layer in proximity to the light guiding structure so as to receive the cooling.
Public/Granted literature
- US20120147906A1 LASER COOLING OF MODIFIED SOI WAFER Public/Granted day:2012-06-14
Information query