Invention Grant
- Patent Title: Embedded processor
- Patent Title (中): 嵌入式处理器
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Application No.: US14010151Application Date: 2013-08-26
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Publication No.: US08775881B2Publication Date: 2014-07-08
- Inventor: Joe M. Jeddeloh
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G01R31/319 ; G01R31/3187 ; G11C29/12 ; G01R31/3183 ; G11C29/10

Abstract:
Electronic apparatus, systems, and methods of operating and constructing the electronic apparatus and/or systems include an embedded processor disposed in a logic chip to direct, among other functions, self-testing of an electronic device structure in conjunction with a pattern buffer disposed in the logic chip, when the electronic device structure is coupled to the logic chip. Additional apparatus, systems, and methods are disclosed.
Public/Granted literature
- US20130346820A1 EMBEDDED PROCESSOR Public/Granted day:2013-12-26
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