Invention Grant
- Patent Title: High availability device level ring backplane
- Patent Title (中): 高可用性设备级环形背板
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Application No.: US13542861Application Date: 2012-07-06
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Publication No.: US08769158B2Publication Date: 2014-07-01
- Inventor: Robert J. Kretschmann , David S. Wehrle , Gerald R. Creech
- Applicant: Robert J. Kretschmann , David S. Wehrle , Gerald R. Creech
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Boyle Fredrickson, S.C.
- Main IPC: H04L12/54
- IPC: H04L12/54 ; G06F13/00 ; G06F13/40

Abstract:
A modular, high-availability network for an industrial control system employs a plurality of base modules having backplane and using network ring topology. Base modules may include I/O base modules for communicating with industrial processes or machines, an adapter base module for communicating with a programmable logic controller (PLC) and/or a bus expansion base module for providing additional I/O base modules. Base modules may be arranged side-by-side, having a backplane in a bank. Another embodiment may include having plurality of banks. The network ring topology used by the base modules is normally opened by a ring supervisor at the ring supervisor location. Upon failure of the network, the ring supervisor reconnects the ring to provide an alternative transmission path around the failure point.
Public/Granted literature
- US20130010588A1 High Availability Device Level Ring Backplane Public/Granted day:2013-01-10
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