Invention Grant
- Patent Title: Electronic apparatus and flexible printed circuit board
- Patent Title (中): 电子仪器和柔性印刷电路板
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Application No.: US13093593Application Date: 2011-04-25
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Publication No.: US08767405B2Publication Date: 2014-07-01
- Inventor: Kota Tokuda , Sadahiro Tamai
- Applicant: Kota Tokuda , Sadahiro Tamai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2010-194366 20100831
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.
Public/Granted literature
- US20120051004A1 Electronic Apparatus and Flexible Printed Circuit Board Public/Granted day:2012-03-01
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