Invention Grant
US08767403B2 Frame having frame blades that participate in cooling memory modules
有权
框架具有参与冷却存储器模块的框架叶片
- Patent Title: Frame having frame blades that participate in cooling memory modules
- Patent Title (中): 框架具有参与冷却存储器模块的框架叶片
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Application No.: US13260207Application Date: 2009-10-30
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Publication No.: US08767403B2Publication Date: 2014-07-01
- Inventor: Timothy Rau , Glenn C. Simon
- Applicant: Timothy Rau , Glenn C. Simon
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2009/062760 WO 20091030
- International Announcement: WO2011/053311 WO 20110505
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.
Public/Granted literature
- US20120020004A1 FRAME HAVING FRAME BLADES THAT PARTICIPATE IN COOLING MEMORY MODULES Public/Granted day:2012-01-26
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