Invention Grant
- Patent Title: Head wrap procedure
- Patent Title (中): 头包装程序
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Application No.: US13928266Application Date: 2013-06-26
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Publication No.: US08767336B2Publication Date: 2014-07-01
- Inventor: Nhan X. Bui , Ernest S. Gale , Reed A. Hancock , Kazuhiro Tsuruta
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Zilka-Kotab, PC
- Main IPC: G11B15/18
- IPC: G11B15/18

Abstract:
A method according to one embodiment includes detecting a signal originating from at least one reader of a first outer module of a head as a tape passes thereacross, the head having at least the first outer module and a second outer modules positioned on opposite sides of an inner module and aligned with the inner module in a direction of tape travel thereacross. A first guide positioned in front of the first outer module is moved in a direction towards the tape until the signal detected by the first outer module decreases. The first guide is moved in a direction away from the tape to a position to set about a predetermined wrap angle of the tape relative to the first outer module after the signal detected by the first outer module decreases.
Public/Granted literature
- US20130286503A1 HEAD WRAP PROCEDURE Public/Granted day:2013-10-31
Information query
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