An integrated circuit die has a first die pad for receiving a first voltage and a second die pad for receiving a second voltage. The second voltage is less than the first voltage. A first circuit which is operable at the first voltage is in the integrated circuit die. A second circuit which is operable at the second voltage is in the integrated circuit die and is connected to the second die pad. A circuit that detects current flow from the second die pad is in the integrated circuit die. A switch is interposed between the first die pad and the first circuit to disconnect the first die pad from the first circuit in response to current flow detected by the circuit for detecting current flow.