A method and system to facilitate the usage of memory modules that have one or more defective memory dies. In one embodiment of the invention, a memory module is packaged with a number of dies and the memory module is tested and sorted according to the number of dies that pass testing. Each signal of each die in the memory module has an unique bond-out or connection point in the package of the memory module. By separating the signals of each die in the memory module, any defective die can be easily isolated and this allows a significant cost reduction in products that use a large number of dies.