Invention Grant
US08705010B2 Lithography system, method of clamping and wafer table 有权
平版印刷系统,夹紧方法和晶圆台

Lithography system, method of clamping and wafer table
Abstract:
The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.
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