Invention Grant
- Patent Title: Lithography system, method of clamping and wafer table
- Patent Title (中): 平版印刷系统,夹紧方法和晶圆台
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Application No.: US12218080Application Date: 2008-07-11
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Publication No.: US08705010B2Publication Date: 2014-04-22
- Inventor: Guido De Boer , Michel Pieter Dansberg , Pieter Kruit
- Applicant: Guido De Boer , Michel Pieter Dansberg , Pieter Kruit
- Applicant Address: NL Delft
- Assignee: Mapper Lithography IP B.V.
- Current Assignee: Mapper Lithography IP B.V.
- Current Assignee Address: NL Delft
- Agency: Blakely Sokoloff Taylor & Zafman
- Main IPC: G03B27/60
- IPC: G03B27/60 ; G03B27/58 ; G03B27/52

Abstract:
The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.
Public/Granted literature
- US20090027649A1 Lithography system, method of clamping and wafer table Public/Granted day:2009-01-29
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