Invention Grant
- Patent Title: Automatic place and route method for electromigration tolerant power distribution
- Patent Title (中): 用于电迁移容量配电的自动放置和布线方法
-
Application No.: US13331329Application Date: 2011-12-20
-
Publication No.: US08694945B2Publication Date: 2014-04-08
- Inventor: Chung-Hsing Wang , King-Ho Tam , Huang-Yu Chen
- Applicant: Chung-Hsing Wang , King-Ho Tam , Huang-Yu Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L23/498

Abstract:
The present disclosure relates to an electromigration tolerant power distribution network generated by an automatic place and route (APR) methodology. In some embodiments, an automatic place and route tool constructs a local power network having multi-level power rails. The multi-level power rails have interleaved segments of vertically adjacent metal layers, wherein each interleaved segment is shorter than a predetermined characteristic length corresponding to a Blech length. By limiting the length of the interleaved metallization segments, electromigration within the multi-level power rails is alleviated, allowing for the maximum current density requirement (Jmax) for mean time to failures (MTTF) to be increased.
Public/Granted literature
- US20130154128A1 Automatic Place and Route Method for Electromigration Tolerant Power Distribution Public/Granted day:2013-06-20
Information query