Invention Grant
- Patent Title: Circuit and method for parallel perforation in rate matching
- Patent Title (中): 速率匹配中平行穿孔的电路和方法
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Application No.: US13258354Application Date: 2010-06-29
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Publication No.: US08694874B2Publication Date: 2014-04-08
- Inventor: Ziyu Wen
- Applicant: Ziyu Wen
- Applicant Address: CN Shenzhen
- Assignee: ZTE Corporation
- Current Assignee: ZTE Corporation
- Current Assignee Address: CN Shenzhen
- Agency: Oppedahl Patent Law Firm LLC
- Priority: CN200910148724 20090701
- International Application: PCT/CN2010/074716 WO 20100629
- International Announcement: WO2011/000308 WO 20110106
- Main IPC: H03M13/03
- IPC: H03M13/03

Abstract:
A circuit and a method for parallel perforation in rate matching can adopt three selector arrays and three register groups. The first selector array is configured to remove null bits in input data and output the remaining data to the first register group; the second selector array is configured to combine the first register group and the third register group and then output the combined data to the second register group; during the combination, the valid data in the third register group are preferentially selected, and then the data in the first register group are selected; Further, the third selector array is configured to output remaining valid data in the first selector group to the third register group if the valid data in the first selector group are not used out while combining the first register group and the third register group by the second selector array.
Public/Granted literature
- US20120096238A1 Circuit and method for parallel perforation in speed rate matching Public/Granted day:2012-04-19
Information query
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