Invention Grant
- Patent Title: Method and system for testing chips
- Patent Title (中): 测试芯片的方法和系统
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Application No.: US12938392Application Date: 2010-11-03
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Publication No.: US08694839B2Publication Date: 2014-04-08
- Inventor: Hsiang-Che Hsu , Bowei Hsieh
- Applicant: Hsiang-Che Hsu , Bowei Hsieh
- Applicant Address: TW Hsin-Tien, Taipei Hsien
- Assignee: VIA Technologies Inc.
- Current Assignee: VIA Technologies Inc.
- Current Assignee Address: TW Hsin-Tien, Taipei Hsien
- Agent Winston Hsu; Scott Margo
- Priority: TW95139525A 20061026
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G06F11/00 ; G01R31/08 ; G08C15/00 ; H04J1/16
Abstract:
A chip operating method is provided which includes enabling a transmission mechanism or a receiving mechanism of the chip while normally operating the chip. The method further includes enabling both of the transmission mechanism and the receiving mechanism of the chip while testing the chip.
Public/Granted literature
- US20110047420A1 METHOD AND SYSTEM FOR TESTING CHIPS Public/Granted day:2011-02-24
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