A packaging apparatus for packaging a bundle of conductors, such as optical fibers, includes a housing having two U-shaped halves that attach to one another wherein at least one of the halves includes connecting portions that each retain a connector of the conductors. The method includes attaching the connectors of the conductors to the connecting portions of one half, gathering the conductors at a location beyond an end of the first half, and attaching the second half to the first half. The conductors extend through a conductor insertion hole formed in the housing when the two halves are attached to one another. A plurality of packaging apparatuses can be flexibly attached to one another in series.