Invention Grant
- Patent Title: Optoelectronic composite substrate and method of manufacturing the same
- Patent Title (中): 光电复合基板及其制造方法
-
Application No.: US13079951Application Date: 2011-04-05
-
Publication No.: US08693815B2Publication Date: 2014-04-08
- Inventor: Kazunao Yamamoto
- Applicant: Kazunao Yamamoto
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2010-106956 20100507
- Main IPC: G02B6/00
- IPC: G02B6/00

Abstract:
A method of manufacturing an optoelectronic composite substrate, includes forming a first cladding layer in an area except the connection pad on a wiring substrate including a connection pad on an upper surface, forming a belt-like core layer on the first cladding layer, and obtaining an optical waveguide having a structure in which the core layer is surrounded by the first cladding layer and the second cladding layer, by forming a second cladding layer which covers the core layer. A thickness of the first cladding layer is set identically to a thickness of the connection pad, and thus a level difference caused by the connection pad is eliminated.
Public/Granted literature
- US20110274388A1 OPTOELECTRONIC COMPOSITE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-11-10
Information query