Invention Grant
- Patent Title: Loss modulated silicon evanescent lasers
- Patent Title (中): 损耗调制硅瞬逝激光器
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Application No.: US12827776Application Date: 2010-06-30
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Publication No.: US08693509B2Publication Date: 2014-04-08
- Inventor: John E. Bowers , Daoxin Dai
- Applicant: John E. Bowers , Daoxin Dai
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Kaplan Breyer Schwarz & Ottesen, LLP
- Main IPC: H01S3/10
- IPC: H01S3/10 ; H01S5/323

Abstract:
Loss modulated silicon evanescent lasers are disclosed. A loss-modulated semiconductor laser device in accordance with one or more embodiments of the present invention comprises a semiconductor-on-insulator (SOI) structure resident on a first substrate, the SOI structure comprising a waveguide in a semiconductor layer of the SOI structure, and a semiconductor structure bonded to the semiconductor layer of the SOI structure, wherein at least one region in the semiconductor layer of the SOI structure controls a photon lifetime in the semiconductor laser device.
Public/Granted literature
- US20120002694A1 LOSS MODULATED SILICON EVANESCENT LASERS Public/Granted day:2012-01-05
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