Invention Grant
- Patent Title: Cover lifting structure and electronic system with cover lifting structure
- Patent Title (中): 盖提升结构和带盖提升结构的电子系统
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Application No.: US13615634Application Date: 2012-09-14
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Publication No.: US08693175B2Publication Date: 2014-04-08
- Inventor: Shin-Min Lee
- Applicant: Shin-Min Lee
- Applicant Address: TW Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; A47B81/00 ; A47B96/06

Abstract:
A cover lifting structure is suitable for a body of an electronic device. The body has a recess. The cover lifting structure includes a first rotating member, a second rotating member, an elastic member and a pushing member. The first rotating member pivoted to the body with a first axis. The second rotating member pivoted to the first rotating member with a second axis. The elastic member is propped against the first and the second rotating members. The first rotating member closes the recess, and the second rotating member contacts against the pushing member in a first state. The first rotating member opens the recess, and the second rotating member moves away from the pushing member in a second state. In a third state, the first rotating member closes the recess, and the second rotating member falls behind a stroke to the first rotating member.
Public/Granted literature
- US20130077216A1 COVER LIFTING STRUCTURE AND ELECTRONIC SYSTEM WITH COVER LIFTING STRUCTURE Public/Granted day:2013-03-28
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