Invention Grant
- Patent Title: Protection apparatus for load circuit
- Patent Title (中): 负载电路保护装置
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Application No.: US13376242Application Date: 2010-05-19
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Publication No.: US08693156B2Publication Date: 2014-04-08
- Inventor: Yoshihide Nakamura , Akinori Maruyama , Keisuke Ueta
- Applicant: Yoshihide Nakamura , Akinori Maruyama , Keisuke Ueta
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-134793 20090604
- International Application: PCT/JP2010/058472 WO 20100519
- International Announcement: WO2010/140474 WO 20101209
- Main IPC: H02H5/04
- IPC: H02H5/04 ; H02H3/20

Abstract:
A protection apparatus for a load circuit is provided which can miniaturize electric wires and semiconductor switches by using a switch circuit simulating the current interruption time characteristics of fuses. A conductor resistance r and a heat resistance R used in each of a heat generation temperature calculation expression and a heat dissipation temperature calculation expression are respectively changed into a pseudo conductor resistance r* and a pseudo heat resistance R*, then the heat generation amount and the heat dissipation amount of the electric wire are calculated, and current temperature of the electric wire is estimated. When the estimation temperature reaches allowable temperature, an electronic switch S1 is turned off to thereby protect the load circuit. As a result, each of the electric wires and the semiconductor switches used in the load circuit can be protected from over heat.
Public/Granted literature
- US20120081825A1 PROTECTION APPARATUS FOR LOAD CIRCUIT Public/Granted day:2012-04-05
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